Step 1 - DFM review. Your Gerber, BOM and centroid files are checked for footprint mismatches, polarity marks and paste-layer coverage before anything enters production.
Step 2 - Stencil. A laser-cut stainless stencil is made from your paste layer; frameless 37x47 cm stencils fit our printers. Stencils are archived for repeat orders.
Step 3 - Solder paste printing. Automated printers with vision alignment deposit lead-free SAC305 paste. Paste height and volume are verified against the aperture design.
Step 4 - 3D SPI. 100% solder paste inspection measures volume, area and height per pad. Bad prints are washed and reprinted before placement.
Step 5 - Component placement. High-speed mounters place down to 01005 with +/-25 um accuracy; fine-pitch and odd-form parts run on high-precision modules.
Step 6 - Reflow. Lead-free reflow profiles are set per board from paste and component specs; thermal profiling is documented per batch.
Step 7 - AOI. 100% post-reflow AOI checks component presence, polarity, offset and solder joint quality on every board.
Step 8 - Through-hole assembly. THT parts are inserted manually or by machine; wave or selective soldering follows, chosen by board density.
Step 9 - Cleaning and inspection. No-clean or water-wash flux management per your spec, followed by visual inspection to IPC-A-610.
Step 10 - ICT/FCT. In-circuit test with your fixture, or functional test to your procedure, plus final QC sampling and packing with ESD protection.
Every step feeds the lot traveler, so each order has a complete process record. See the files we need to start your assembly order.
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