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Quality management system covering the full order flow — from quotation and engineering review to production, inspection and delivery.
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Medical device QMS. Supports medical PCB assemblies with documented process control, traceability and device history records.
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Automotive quality management: APQP, PPAP documentation support, MSA/SPC process monitoring for automotive electronics.
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Environmental management system — controlled chemistry handling, wastewater treatment and responsible waste disposal in the plating and etching lines.
Occupational health & safety management protecting the people who build your boards.
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UL-recognized laminate constructions for safety-critical applications, plus full RoHS/REACH-compliant surface finishes and solder materials.
IPC Class 3 is the highest acceptance level in IPC-A-600 (bare board) and IPC-A-610 (assembly): products whose continued high performance is critical and where downtime is not acceptable. Class 2 targets standard commercial electronics; Class 3 tightens plating thickness, annular ring, dielectric spacing, solder-joint fillets and allowable rework to near-zero tolerance for deviation.
| Item | Class 2 | Class 3 |
|---|---|---|
| Annular ring (external) | Min 0.05 mm breakout allowed | Min 0.025 mm, no breakout |
| Plating / copper thickness | Min 20 μm finished | Min 25 μm finished |
| Solder joints (IPC-A-610) | Standard fillet requirements | Full wetting, defined fillet heights, no rework on BGA |
| Inspection sampling | AQL sampling plans | Tightened sampling / 100% on critical items |
Pricing and lead time: Class 3 builds carry a process surcharge (shown per layer count in the quote) and typically add 1-2 days for tightened inspection. Class 3 projects are assessed individually — contact sales with your stackup and acceptance spec.
Tell us your industry and required standards — we quote accordingly.
