BGA Assembly Capability: 0.25 mm Pitch, X-Ray Verified

Package Types We Place

• BGA / uBGA / CSP - down to 0.25 mm ball pitch (0.3 mm and 0.4 mm are the most common).
• QFN / LGA - leadless packages with bottom thermal pads, paste-divided apertures for void control.
• PGA / connector sockets - press-fit and soldered types.

Process Capability

• Min BGA pitch: 0.25 mm
• Smallest passives: 01005
• Placement accuracy: +/-25 um
• Lead-free SAC305 soldering; SnPb available on request
• Max panel size: 480 x 420 mm

X-Ray Verification

Every BGA order passes 100% X-Ray inspection: ball alignment, bridging, voids (per IPC-7095 limits) and head-in-pillow indicators are checked and archived. AOI cannot see under the package - X-Ray can, and we do not skip it.

BGA Rework

Profiled hot-gas rework stations remove and replace BGAs up to 45 mm square: site dressing, solder-ball re-attach for strip balls, and post-rework X-Ray re-verification. Rework is available both for our own builds (repair loops) and for customer-supplied boards.

Planning a 0.25 mm pitch build? Send your centroid file with the assembly quote and we confirm placement capability before you commit.