High & Advanced PCB Manufacturing: HDI, 20+ Layers, Back-Drilling

What Counts as High & Advanced PCB

When standard FR-4 rules run out - fine pitch BGAs, dense blind/buried via structures, 20+ layer backplanes or RF hybrid stacks - our advanced line takes over:

• HDI anylayer: 1+N+1, 2+N+2 and beyond, laser microvias down to 0.1 mm.
• 20+ layers: sequential lamination, back-drilling for high-speed signal integrity.
• Hybrid / mixed-dielectric: Rogers + FR-4 co-lamination for RF plus digital on one board.
• Heavy copper: 3-6 oz inner and outer layers for power backplanes.

Representative Build Parameters

Quality Verification

Every advanced build ships with AOI on all layers, X-Ray verification of drilled microvias, impedance coupons with measurement reports, and flying-probe or universal E-test per your spec. Cross-section analysis is available for first-article approval.

Request an advanced PCB quote - upload your stackup and we return a manufacturability review with the quote.