Complete parameter table maintained in CMS — hover remarks for engineering details.
| Max Panel Size | 480mm x 420mm | Maximum PCB panel dimensions for assembly |
| Min Track / Spacing | 3mil / 3mil | |
| Min BGA Pitch | 0.25mm | |
| Smallest Component | 01005 | |
| Placement Accuracy | +/-25 um | |
| Solder Paste Inspection | 100% 3D SPI | Inline after printing |
| Soldering Process | Lead-free reflow & wave | Nitrogen optional |
| Component Types | BGA / QFN / LGA / 0201 / Connectors | |
| Daily SMT Capacity | 12,000,000 points | |
| Inspection | 100% AOI + X-Ray for BGA | IPC-6012 Class 2/3 |
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